基于多层LCP基板的高密度系统集成技术

定　　价：98 元

丛书名：微电子与集成电路技术丛书

• 作者：刘维红 等
• 出版时间：2024/3/1
• ISBN：9787121472787
• 出 版 社：电子工业出版社

• 中图法分类：TN402 
• 页码：224
• 版次：01
• 开本：16开

内容简介

本书共 5 章，第 1 章为 LCP 材料简介及制备工艺，第 2 章为多层 LCP 电路板中过孔互连结构的研究，第 3章为毫米波射频前端系统中键合线电路的分析与设计，第 4 章为微带线-微带线槽线耦合过渡结构，第 5 章为基于 LCP 无源器件的设计与研究。本书从 LCP 电路的制备工艺讲起，系统地阐述了双层及多层 LCP 电路板的制备过程，以及激光开腔工艺的实现方法，为电路设计工程技术人员提供了工艺参考。同时，本书对多层 LCP 电路板中过孔互连结构的建模进行了深入的讨论，为毫米波宽带电路设计提供了借鉴。为了克服多层 LCP 电路板中过孔不易实现的难题，本书对槽线耦合过渡结构进行了系统研究，并且基于多模耦合理论，设计了毫米波频段的超宽带过渡结构。LCP 无源器件的设计为 LCP 电路系统一体化集成提供了优异的解决方案。本书可作为微波、毫米波电路设计人员的参考资料。

作者介绍

刘维红，副教授，男，1980年4月出生，中共党员，电子科学与技术专业博士，西安邮电大学电子信息专业硕士生导师。现主要从事射频/微波/毫米波有源无源器件以及集成电路系统的设计与研究。1999年9月至2003年7月就读于陕西理工大学物理系,获理学学士学位。2003年9月到2004年7月在华县咸林中学从事高中物理教学。2004年9月至2007年7月，在西北大学物理系凝聚态物理专业，获得硕士学位。2007年9月到2011年3月，在西安交通大学电子陶瓷与器件教育部重点实验室攻读博士学位。2019年1月到2019年12月在新加坡国立大学做访问学者12个月。2011年4月至今，在西安邮电大学电子工程学院微电子学系主要承担模拟集成电路设计、电子技术基础(模拟部分)的教学工作。主持参与国家以及省部级项目多项，担任电子元器件关键材料与技术专委会委员。获得陕西科学技术奖二等奖一次，陕西高等学校科学技术奖二等奖一次，西安市科学技术一等奖一次。获得专利2项，发表论文二十多篇，其中被SCI、EI索引十多篇。

目 录

第 1 章 LCP 材料简介及制备工艺 ··············································································1
1.1 LCP 材料的发展历史 ···················································································.1
1.2 LCP 材料的基本特性 ···················································································.4
1.3 LCP 材料的应用 ·························································································.6
1.4 单层 LCP 基板制备工艺 ·············································································.10
1.5 多层 LCP 基板制备工艺 ·············································································.13
1.6 多层 LCP 基板关键工艺技术 ·······································································.17
1.7 本章总结 ································································································.22
1.8 参考文献 ································································································.22
第 2 章 多层 LCP 电路板中过孔互连结构的研究 ························································24.
2.1 多层 LCP 电路板建模方法的研究 ·································································.24
2.1.1 多层 LCP 电路板建模方法的研究与发展现状 ··············································.24
2.1.2 带有过孔的多层 LCP 电路板建模流程 ·······················································.28
2.2 CPWG-SL-CPWG 过孔互连结构的设计与实现 ················································.30
2.2.1 过孔互连结构的基本模型 ······································································.31
2.2.2 过孔互连结构的仿真设计 ······································································.33
2.2.3 过孔互连结构的匹配优化 ······································································.36
2.2.4 过孔互连结构的表征与测试 ···································································.41
2.3 CPWG-SL-CPWG 过孔互连结构的快速收敛等效电路模型 ·································.42
2.3.1 典型的П型等效电路模型 ······································································.43
2.3.2 П型等效电路模型寄生参数提取 ······························································.44
2.3.3 过孔互连结构的快速收敛等效电路模型的构建 ············································.49
2.3.4 等效电路模型的仿真验证 ······································································.51
2.4 CPWG-SL-CPWG 过孔互连结构的高精度等效电路模型 ····································.53
2.4.1 电源／接地面对过孔传输特性的影响 ························································.54
2.4.2 典型过孔的内在等效电路模型·································································.57
2.4.3 内在等效电路模型的参数提取·································································.59
2.4.4 过孔互连结构的高精度等效电路模型的构建 ···············································.61
2.4.5 等效电路模型的仿真验证 ······································································.62
2.5 本章总结 ································································································.65
2.6 参考文献 ································································································.66
第 3 章 毫米波射频前端系统中键合线电路的分析与设计 ·············································.70
3.1 键合线材料的分析 ····················································································.71
3.2 引线键合技术的简介 ·················································································.72
3.3 键合线等效电路模型的构建 ········································································.74
3.3.1 键合线几何长度的提取 ·········································································.74
3.3.2 键合线寄生参数的提取 ·········································································.77
3.3.3 双线键合的等效电路模型 ······································································.79
3.3.4 键合线结构参数对其传输特性的影响 ························································.80
3.4 Ka 波段键合线匹配电路的设计与实现 ··························································.87
3.4.1 基于微带线的单线键合匹配电路 ······························································.87
3.4.2 基于微带线的双线键合匹配电路 ······························································.94
3.5 W 波段键合线匹配电路的设计与实现 ···························································.99
3.5.1 基于 CPWG 的双线键合匹配电路 ···························································.100
3.5.2 基于 CPWG 的单线键合匹配电路 ···························································.107
3.6 基于 LCP 基板的键合线匹配电路的设计流程 ·················································.112
3.7 本章总结 ·······························································································.113
3.8 参考文献 ·······························································································.114
第 4 章 微带线-微带线槽线耦合过渡结构 ································································.116
4.1 微带线-微带线槽线耦合过渡结构的基本特性 ················································.116
4.1.1 微带线-微带线槽线耦合过渡结构的提出 ··················································.116
4.1.2 微带线-微带线槽线多模谐振器的基本结构 ···············································.117
4.1.3 微带线-微带线槽线多模谐振器的工作原理 ···············································.117
4.1.4 微带线-微带线槽线耦合过渡结构等效电路模型分析 ···································.118
4.2 T 型枝节线槽线耦合过渡结构 ····································································.120
4.2.1 T 型枝节线槽线耦合过渡结构等效电路分析 ··············································.120
4.2.2 均匀双槽线耦合过渡结构的设计 ·····························································.122
4.2.3 T 型枝节线槽线耦合过渡结构的设计 ·······················································.128
4.2.4 T 型枝节线槽线耦合过渡结构的制作工艺 ·················································.132
4.2.5 T 型枝节线槽线耦合过渡结构的表征与测试 ··············································.133
4.3 微带枝节加载槽线耦合过渡结构 ·································································.135
4.3.1 微带枝节加载槽线谐振器的提出 ·····························································.135
4.3.2 微带枝节加载槽线耦合过渡结构的设计 ····················································.136
4.3.3 微带枝节加载槽线耦合过渡结构的表征与测试 ···········································.146
4.4 环形谐振器槽线耦合过渡结构 ····································································.149
4.4.1 环形谐振器均匀双槽线耦合过渡结构的设计 ··············································.149
4.4.2 环形谐振器背对背 Y 型槽线耦合过渡结构的设计 ·······································.150
4.4.3 环形谐振器 H 型槽线耦合过渡结构的设计 ················································.153
4.4.4 环形谐振器槽线耦合过渡结构的表征与测试 ··············································.155
4.5 本章总结 ·······························································································.158
4.6 参考文献 ·······························································································.159
第 5 章 基于 LCP 无源器件的设计与研究 ·······························································.161
5.1 LCP 无源电感的概述 ················································································.161
5.2 LCP 集总参数电感性能的研究 ····································································.164
5.2.1 水平螺旋电感性能的研究 ·····································································.164
5.2.2 平面螺旋电感性能的研究 ·····································································.169
5.2.3 8-shaped 型电感性能的研究 ···································································.175
5.3 LCP 分布式电感性能的研究 ·······································································.178
5.4 垂直叉指电容的概述 ················································································.180
5.5 垂直叉指电容性能的研究 ··········································································.181
5.5.1 电容 型等效电路模型的分析 ·································································.181
5.5.2 二端口电容结构参数的分析 ··································································.183
5.5.3 单端口电容结构参数的分析 ··································································.187
5.6 垂直叉指电容的优化设计 ··········································································.189
5.6.1 带有 DGS 的二端口正方形垂直叉指电容 ··················································.190
5.6.2 带有 DGS 的单端口正方形垂直叉指电容 ··················································.191
5.7 UHF 滤波器设计的概述 ············································································.195
5.8 UHF 集总参数低通滤波器的设计 ································································.197
5.8.1 低通滤波器电路与参数的分析································································.197
5.8.2 低通滤波器的仿真设计 ········································································.198
5.8.3 低通滤波器的实物测试 ········································································.200
5.9 UHF 集总参数带通滤波器的设计 ································································.202
5.9.1 带通滤波器的仿真设计 ········································································.202
5.9.2 带通滤波器的实物测试 ········································································.205
5.10 UHF 半集总参数双通带通滤波器的设计 ·····················································.207
5.10.1 半集总滤波器电路与参数分析 ······························································.207
5.10.2 半集总滤波器的仿真设计 ····································································.210
5.10.3 半集总滤波器的实物测试 ····································································.212
5.11 本章总结 ·····························································································.214
5.12 参考文献 ·····························································································.215